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  1. Product
one two four
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    4.jpg

    4" Wafer Metallization Appearance

    Backside Grinding
    Si Wafer Thinning down to 50um
    GaN on Si Thinning down to 75um
    SiC Thinning down to 150 um
    TTV ≤ 10um

    Backside Metallization
    Support Multi-layer Deposition：Ti, Ni, Ag, Sn, Cu, Al
    Metal Thickness up to 35um
    Uniformity: ±10%
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    6.jpg

    6" Wafer Metallization Appearance

    Backside Grinding
    Si Wafer Thinning down to 50um
    GaN on Si Thinning down to 75um
    SiC Thinning down to 150 um
    TTV ≤ 10um

    Backside Metallization
    Support Multi-layer Deposition：Ti, Ni, Ag, Sn, Cu, Al
    Metal Thickness up to 35um
    Uniformity: ±10%
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    8霧面.jpg

    8" Wafer Metallization Appearance

    Backside Grinding
    Si Wafer Thinning down to 50um
    GaN on Si Thinning down to 75um
    SiC Thinning down to 150 um
    TTV ≤ 10um

    Backside Metallization
    Support Multi-layer Deposition：Ti, Ni, Ag, Sn, Cu, Al
    Metal Thickness up to 35um
    Uniformity: ±10%
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    12吋 _1_.jpg

    12" Wafer Metallization Appearance

    Backside Grinding
    Si Wafer Thinning down to 50um
    GaN on Si Thinning down to 75um
    SiC Thinning down to 150 um
    TTV ≤ 10um

    Backside Metallization
    Support Multi-layer Deposition：Ti, Ni, Ag, Sn, Cu, Al
    Metal Thickness up to 35um
    Uniformity: ±10%