Product Introduction
The Micro Metal Electronics (MMEC) team is familiar with the integration and analysis of front, middle, and back-end processes, including front-end wafer foundries, wafer thinning plants, and back-end packaging factories, enabling them to assist clients in rapid development, problem-solving, and stable mass production, providing comprehensive and reliable semiconductor wafer services.
Services & Specifications
| Product / Service | Description |
|---|---|
| Wafer Size | 4"、5"、6"、8"、12" |
| Backside Grinding | Si Wafer Thinning down to 50µm GaN on Si Thinning down to 75µm SiC Thinning down to 150µm TTV ≤ 10µm |
| Backside Metallization | Support Multi-layer Deposition: Ti, Ni, Ag, Sn, Cu, Al Metal Thickness up to 35µm Uniformity: ±10% |
MMEC Competitive Advantage
- High-spec production equipment – equipped with fully automatic grinding machines and vacuum coating machines, ensuring stable high yield.
- Experienced technical team – over 18 years of grinding and metallization technology, with accumulative production of over 4 million wafers.
- Quick delivery and flexible production – small batch samples, rapid trial production, and stable high-quality mass production.
- Strict quality control – in compliance with ISO 9001 and IATF 16949 international certifications.
Micro Metal Electronics (MMEC) continuously enhances its process technology and yield, providing flexible customized services according to customer needs, assisting the industry in achieving high efficiency, high quality, and stable mass production goals, and becoming a trusted partner in the semiconductor industry.